How big is Thermal Conductive Bonding, Inc.'s plan?

Thermal Conductive Bonding, Inc.'s plan reported $2.0M in assets and 32 participants for 2024.

Original filing (PDF)20250630190751NAL0012164321001

Thermal Conductive Bonding, Inc.

Name: Thermal Conductive Bonding, Inc. — TCB 401(k) Plan, Form 5500 (2024)
Creator: Thermal Conductive Bonding, Inc.
License: https://www.usa.gov/government-works

Form 5500-SF

FILING_RECEIVED

TCB 401(k) Plan

401(k) retirement plan · Thermal Conductive Bonding, Inc.'s TCB 401(k) Plan held $2.0M in plan assets for 32 participants in 2024.

Active participants

Accounts w/ balance

Plan assets (EOY)

$2.0M

Net assets (EOY)

$2.0M

Plan identifiers

Thermal Conductive Bonding, Inc.'s EIN is 88-0395437.

EIN 88-0395437

Plan number 001

Plan year 2024

ACK ID 20250630190751NAL0012164321001

Official Form 5500 document

Download the official 2024 Form 5500 (PDF) for Thermal Conductive Bonding, Inc. from the U.S. Department of Labor's EFAST2 system.

Download the official 2024 Form 5500 (PDF)

Plan features

Thermal Conductive Bonding, Inc.'s plan includes profit-sharing, ERISA 404(c) participant direction, a 401(k) feature, automatic enrollment, a default investment (QDIA).

Decision-maker contacts

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Plan health score

Above-average plan

Directional indicator from public Form 5500 data — compliance & integrity, total plan cost, participant health and vendor stack, benchmarked against same-size peers. Not a fiduciary tool. Based on 70% of scoring inputs for this filing.

Compliance & integrity

100

Total plan cost

n/a

Plan health

Vendor & structure

100

Helping the score